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Utilization of automatic inspection system to detect submicron particles
During the process to cut mother glass sheets, fine particles (minute pieces of glass) measuring several microns in diameter adhere to the sheet surfaces. These particles can cause minute scratches to the glass or result in failure during customer production processes. To tackle this problem, AvanStrate introduced original automated evaluation equipment that is the first of its kind anywhere in the world. This equipment can detect submicron particles and scratches. It is also used to optimize the production process, for example, to monitor process quality by analyzing the images obtained, allowing our glass sheets to be adapted to the specifications of each customer.
Laser cutting technology for reducing fine particles and improving glass cutting quality
Previously, glass sheets were cut with a diamond wheel in most cases. AvanStrate has been working on the practical application of a high-performance laser cutter equipped with an advanced laser head. Compared with a diamond wheel, a laser cutter can reduce the amount of particles generated. It can also cut down on the number of production steps since it eliminates the need for edge-cutting. Furthermore, a laser cutter can cut glass into various shapes and make holes as well, which makes it adaptable to a wide range of future applications.
0.4-mm thickness achieved to meet the needs for lighter weight and higher yield
Mobile devices must be lighter and manufactured with increasingly higher efficiency. As such, there has been intense competition in the industry to develop technologies for forming thinner glass and a glass composition with a smaller specific gravity. AvanStrate is promoting research and development to meet such needs. So far, we have succeeded in forming 5th- and 8th-generation glass substrates measuring 0.4 and 0.5 mm in thickness, respectively and the development of 0.3-mm thick substrates is now under way. We are accumulating unique technologies and expertise because 0.3-mm substrates require highly sophisticated properties; that is they must be extremely thin but with minimum strain and reduced thermal shrinkage.
